Strain-induced anodic dissolution of Cu single crystals—effects of specimen geometry and slip morphology
- 31 December 1983
- journal article
- Published by Elsevier in Corrosion Science
- Vol. 23 (9) , 959-968
- https://doi.org/10.1016/0010-938x(83)90023-9
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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- Decrease of back stress and softening of work hardened copper-silica crystals by recoveryActa Metallurgica, 1975
- Mechano-electrochemical dissolution of copper at reversible electrode potentialCorrosion Science, 1973
- Effects of Plastic Deformation on the Electrochemical Dissolution of CopperJournal of the Japan Institute of Metals and Materials, 1972
- Mechanochemical Behavior of Cu/Cu＋＋ ElectrodeDenki Kagaku oyobi Kogyo Butsuri Kagaku, 1971
- Mechanism of the Acceleration of the Electrodic Dissolution of Metals during Yielding under StressThe Journal of Chemical Physics, 1968
- Dependence of the Velocity of the Anodic Dissolution of Iron on Its Yield Rate under TensionThe Journal of Chemical Physics, 1967