Parylene encapsulation of ceramic packages for liquid nitrogen application
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 345-350
- https://doi.org/10.1109/ectc.1990.122213
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Ceramic packages for liquid-nitrogen operationIEEE Transactions on Electron Devices, 1989
- Parylene Thin Films for Radiation ApplicationsReview of Scientific Instruments, 1970