Thermally Conductive Ceramics for Electronic Packaging

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Abstract
A survey was conducted on the physical properties of several new ceramic systems, such as carbides, borides, oxides, and nitrides, as they appeared in recent literature, and they are briefly reviewed. A few new ceramic materials, such as BeO, BN, AlN, and SiC-BeO, possess superior thermal properties when compared to the alumina (Al2O3) ceramics used in electronic packaging. Among these, the aluminum nitride (AlN) has emerged as unique material that can replace alumina in future electronic packaging for improved thermal performance and reliability.

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