Rapid prototyping of silicon structures by aid of laser and abrasive-jet machining

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Abstract
Rapid prototyping of silicon microstructures for fluidic devices using laser machining in water and abrasive-jet machining through mask is described. For laser machining a Q-switched 1-2 W 1 kHz pulsed Nd:YAG laser beam and 60 mJ XeCl excimer laser beam were used. The laser beam was scanned along the silicon surface at speeds 0.1-2 mm/s. Using excimer laser, the silicon nitride layer was patterned for subsequent chemical etching. Nd:YAG laser was used for fabrication of cavities and channels of depth down to 200 micrometers . Comparison of Nd:YAG laser machining of silicon in air and in water has been performed. Machining in water yields more even surfaces and there is no debris. By abrasive jet of velocity approximately 200 m/s and abrasive feed rate of 0.4 g/s, the silicon was eroded at speed of 40 micrometers /min. Several masking materials were compared, whereby a styrene based glue was found to have the best abrasion resistivity. The polymer masks were spun on the surface and patterned by excimer laser point or by knife. The described fabrication methods were used for making the fluid channels and chambers in silicon and for releasing silicon nitride and oxide films.

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