The characterization of telephone cord buckling of compressed thin films on substrates
- 12 June 2002
- journal article
- Published by Elsevier
- Vol. 50 (11) , 2355-2377
- https://doi.org/10.1016/s0022-5096(02)00034-0
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Delamination of compressed films on curved substratesJournal of the Mechanics and Physics of Solids, 2001
- Mode-dependent toughness and the delamination of compressed thin filmsJournal of the Mechanics and Physics of Solids, 2000
- The influence of imperfections on the nucleation and propagation of buckling driven delaminationsJournal of the Mechanics and Physics of Solids, 2000
- The post-buckling response of a bi-laterally constrained columnJournal of the Mechanics and Physics of Solids, 1998
- Effect of interface undulations on the thermal fatigue of thin films and scales on metal substratesActa Materialia, 1997
- Buckling Instability of Straight Edge CracksJournal of Applied Mechanics, 1995
- Energy release rates and stability of straight-sided, thin-film delaminationsActa Metallurgica et Materialia, 1993
- Plane-strain, buckling-driven delamination of thin films: Model experiments and mode-II fractureActa Metallurgica et Materialia, 1992
- Growth and configurational stability of circular, buckling-driven film delaminationsActa Metallurgica et Materialia, 1992
- Influence of Water Vapor on Crack Propagation in Soda-Lime GlassJournal of the American Ceramic Society, 1967