Interaction of copper with a vapor deposited polyimide film

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Abstract
The interaction of copper with a vapor deposited film of PMDA-ODA polyimide was studied using x-ray photoelectron spectroscopy (XPS) and scanning tunneling microscopy (STM). Copper was evaporated onto the polyimide surface to a total thickness estimated to be about five atomic layers. The copper initially interacts with the planar imide ring—the nitrogen XPS signal is preferentially attenuated, some copper is oxidized, and the carbonyl XPS intensities are altered. We find no evidence for chemical interaction with the ODA part of the polyimide. Heating the copper covered surface leads to redistribution of copper, probably below the surface as reported in earlier studies. STM images of the heated surfaces show that substantial surface roughening has occurred.

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