Silicone-rubber adhesives as encapsulants for microelectronic implants; effect of high electric fields and of tensile stress
- 1 November 1977
- journal article
- research article
- Published by Springer Nature in Medical & Biological Engineering & Computing
- Vol. 15 (6) , 712-715
- https://doi.org/10.1007/bf02457937
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- The Encapsulation of Microelectronic Devices for Long-Term Surgical ImplantationIEEE Transactions on Biomedical Engineering, 1976
- A vacuum centrifuge for void-free potting of implantable hybrid microcircuits in siliconeMedical & Biological Engineering & Computing, 1975