Antistatic protection in wafer drying process by spin-drying
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Semiconductor Manufacturing
- Vol. 5 (3) , 234-240
- https://doi.org/10.1109/66.149814
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Suppression of particle generation in a modified clean room corona air ionizerJournal of Aerosol Science, 1990
- Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafersIEEE Transactions on Semiconductor Manufacturing, 1989
- Particle-free wafer cleaning and drying technologyIEEE Transactions on Semiconductor Manufacturing, 1989