Electrochemical Behavior of Several Metal Ion Solutions at Ba2YCu3 O 7 and CuO Electrodes

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Abstract
The electrodeposition of metallic coatings onto is desirable for the environmental protection of the underlying superconductor and for providing a parallel current path when the superconductor is in the normal state. Investigations with various voltammetric techniques have been made with simple metal ions in neutral salt media where electrolyte attack of the highly oxidizing substrate can be minimized. Easily reducible metals such as silver and mercury can be plated; the transition to extensive surface reduction of the substrate and failure to plate occurs in the region of potentials required for copper reduction. is attacked by most buffer acids—cathodically generated local pH increases in unbuffered salts can lead to precipitation processes. Parallel studies at pellet electrodes and noble metal electrodes have been carried out as models.

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