Crack formation in epitaxial [110] thin films of YBa2Cu3O7−δ and PrBa2Cu3O7−x on [110]SrTiO3 substrates

Abstract
A characteristic feature of epitaxial [110] thin films of YBa2Cu3O7−δ and PrBa2Cu3O7−x on [110]SrTiO3 substrates is that the films have a tendency to crack along the (001) planes. We have studied the crack spacing as a function of deposition temperature and film thickness. The experimental data have been found to be in excellent agreement with a theoretical analysis of the crack spacings in brittle films. The study has allowed us to determine the critical thickness below which no cracks are expected to form as a function of temperature for [110] films of YBa2Cu3O7−δ, PrBa2Cu3O7−x, and YBa2Cu3O7−δ/ PrBa2Cu3O7−x bilayers.