Simple technology for bulk accelerometer based on bond and etch back silicon on insulator wafers
- 15 June 1998
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 68 (1) , 299-302
- https://doi.org/10.1016/s0924-4247(98)00022-3
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Nondestructive Anodic Bonding TestJournal of the Electrochemical Society, 1997
- Fabrication and characterization of a twin-mass accelerometerSensors and Actuators A: Physical, 1994
- Precision accelerometers with μg resolutionSensors and Actuators A: Physical, 1990