Processes for multilevel metallization

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Abstract
Film deposition and etching techniques for producing multilevel metallized structures on complex devices are reviewed. Emphasis is placed on process procedures for controlled contouring of topographic features induced during pattern etching, techniques for ensuring coverage by deposited films of topography introduced into the substrate, and dielectric deposition procedures that enhance breakdown strength and minimize pinholes. Broadly, the classes of processes discussed are the following: (i) metallization techniques that reduce susceptibility to electromigration and hillock formation and that ensure step coverage; (ii) dielectric deposition techniques that result in good step coverage, low stress, and low pinhole density; (iii) photolithographic and etching techniques that can taper steps generated in the films and that do not form pinholes.

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