Flip-Chip Interconnections
- 1 January 1992
- book chapter
- Published by Elsevier
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- A new LSI bonding technology 'micron bump bonding technology'Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Direct chip interconnect using polymer bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003