Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders
- 1 November 2003
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 49 (9) , 813-818
- https://doi.org/10.1016/s1359-6462(03)00486-x
Abstract
No abstract availableKeywords
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