Abstract
Recent experiments with low-temperature boiling heat transfer have shown that the determination of the transition point from natural convection to nucleate boiling is important in cooling microelectronic components. This paper discusses the nature of this transition, introduced here as the departure from natural convection (DNC). It is shown that the DNC, which is usually accompanied by excessive temperature overshoot, is just as important a parameter as is the well-known departure from nucleate boiling, (DNB), and that more work is required to understand the behavior of DNC. Some novel surface treatments applied to large-scale integrated (LSI) devices are also described that remove these limiting conditions of DNC and DNB.

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