Thermal Stresses in Annular Glass-to-Metal Seals Under Thermal Shock
- 1 October 1984
- journal article
- Published by American Institute of Aeronautics and Astronautics (AIAA) in AIAA Journal
- Vol. 22 (10) , 1472-1477
- https://doi.org/10.2514/3.48586
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Microcircuit Package Stress Analysis.Published by Defense Technical Information Center (DTIC) ,1982
- Thermal Stress in Cylindrical Glass Seals in Microelectronic Packages Under Thermal ShockPublished by Springer Nature ,1980
- Analysis of Thermal Stresses in Sealed Cylinders and the Effect of Viscous Flow During AnnealJournal of Applied Physics, 1934
- Glass-to-Metal SealsJournal of Applied Physics, 1934