YAG laser direct writing of copper from copper formate films
- 5 March 1990
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 56 (10) , 904-906
- https://doi.org/10.1063/1.102624
Abstract
Very thin copper lines for seeding of chemical copper deposition have been deposited by laser direct writing techniques, using water soluble precursor films from copper formate. Writing speeds of up to 50 mm/s could be reached. The deposition process has a strong influence on the substrate surface, thereby achieving a very stable film adhesion.Keywords
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