A New Chip Carrier for High Performance Applications: Integrated Decoupling Capacitor Chip Carrier (IDCCC)
- 1 September 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (3) , 290-297
- https://doi.org/10.1109/tchmt.1983.1136190
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982
- Design Considerations for High-Frequency Ceramic Chip CapacitorsIEEE Transactions on Parts, Hybrids, and Packaging, 1976