Early package analysis: considerations and case study
- 1 April 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Computer
- Vol. 26 (4) , 30-39
- https://doi.org/10.1109/2.206511
Abstract
Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs settings is included. The case study indicates that the most effective packaging solution for high-performance applications, requiring multichip modules, will likely represent a progression from cofired ceramics (MCM-C) to a thin-film and hybrid cofired ceramic (MCM-D/C) module.Keywords
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