An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (8) , 828-835
- https://doi.org/10.1109/33.273681
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Direct chip interconnect with adhesive-connector filmsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Effect of Room-Temperature-Vulcanized Silicone Cure in Device PackagingPublished by American Chemical Society (ACS) ,1987