The Growth Habit of Electrodeposited Copper

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Abstract
By plating under base reproduction conditions in an acidified copper sulphate solution, the growth processes occurring at polycrystalline cathodes have been studied and compared with those at single crystal cathodes. It has been found that the surface topography of the deposit formed on any one grain of the polycrystalline aggregate is identical to that of a deposit, grown under similar conditions, on a single crystal of the same orientation. The growth habit is in each case related to the atomic configuration of the initial cathode surface. The thickness of the deposit formed on electropolished polycrystalline strip has been found to vary from grain to grain. This may be explained in terms of electrochemical anisotropy. It has been found that the growth habit of thick deposits (10 microns) formed on deeply etched surfaces is similar to that on electropolished surfaces. Mechanical polishing of the basis metal causes the development of a polycrystalline, textured deposit, although some base influence can be detected even through very thick deposits (40 microns). Under certain conditions, deposits of the base-reproduction type can be obtained from cyanide copper solutions. Such deposits develop well-defined surface structures, with large, regular features and highly reflecting facets.

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