Chemical Mechanical Polishing of Interlevel Dielectrics: Models for Removal Rate and Planarity
- 1 January 1992
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip InterconnectsJournal of the Electrochemical Society, 1991
- Chemical processes in glass polishingJournal of Non-Crystalline Solids, 1990