Crack Propagation Experiments on Flip Chip Solder Joints

• 1 January 1998
• journal article
• Published by Springer Nature in MRS Proceedings
• Vol. 515
• https://doi.org/10.1557/proc-515-227

Abstract

Keywords

• TESTER
• AMPLITUDES
• CRACK PROPAGATION
• RESOLUTIONS
• SOLDER
• JOINTS
• HYSTERESIS