Avionics Passive Cooling With Microencapsulated Phase Change Materials
- 1 September 1998
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 120 (3) , 238-242
- https://doi.org/10.1115/1.2792628
Abstract
Analysis for an avionics application typical of remotely located, intermittently operated avionics on aircraft and missiles show that a large weight reduction (about 9:1) can be obtained by using recently developed microencapsulated phase change materials technology instead of a solid aluminum plate for a passive heat sink. Tests with a configuration based on the typical avionics application used for analysis show good agreement with analysis. Use of microencapsulated rather than bulk phase change materials avoids a number of design problems previously encountered with application of such materials.Keywords
This publication has 3 references indexed in Scilit:
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