Computer simulation of single-crystal and polycrystal sputtering I

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Abstract
Sputtering of Cu single-crystal and polycrystal targets by 27 keV Ar ions has been simulated using the new binary collision cascade computer program OKSANA. The sputtering yield, the sputtering and reflection efficiencies, and the absolute and relative contributions to sputtering from various components have been calculated in a broad range of incidence angles. The obtained angular dependences of the sputtering yield have proved to agree with experimental data. Some features of sputtering due to semichannel focusing of incident particles have been found. The contributions to sputtering from several types of linear collision chains and from the primary knock-on atoms are considered in most detail. It has been shown, in particular, that the pure focused, pure defocused, and mixed focused-defocused collision chains contribute noticeably to sputtering. The contribution from the primary knock-on atoms is angle-dependent and reaches its maximum in the range of glancing angles for both single-crystal and polycrystal targets.