Residual stress development during the composite patch bonding process: measurement and modeling
- 2 November 2001
- journal article
- Published by Elsevier
- Vol. 33 (2) , 277-288
- https://doi.org/10.1016/s1359-835x(01)00083-5
Abstract
No abstract availableKeywords
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- Cure Cycle Optimization for the Reduction of Processing-Induced Residual Stresses in Composite MaterialsJournal of Composite Materials, 1993
- The reinforcing effect of composite patch repairs on metallic aircraft structuresInternational Journal of Adhesion and Adhesives, 1992
- Kinetics and thermal characterization of thermoset curePolymer Engineering & Science, 1973