Ceramic Packaging

Publisher Website

1 January 1989

book chapter
Published by Springer Nature

p. 455-522
https://doi.org/10.1007/978-1-4613-1069-3_7

Abstract

No abstract available

This publication has 8 references indexed in Scilit:

Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging
Journal of the American Ceramic Society, 1985
Microelectronic Packaging
Scientific American, 1983
Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
IBM Journal of Research and Development, 1982
Stress corrosion of a low-temperature solder glass
Journal of Non-Crystalline Solids, 1975
A Review of Solder Glasses
Active and Passive Electronic Components, 1975
Design of Logic Circuit Technology for IBM System/370 Models 145 and 155
IBM Journal of Research and Development, 1971
ASLT: An Extension of Hybrid Miniaturization Techniques
IBM Journal of Research and Development, 1967
Solid Logic Technology: Versatile, High-Performance Microelectronics
IBM Journal of Research and Development, 1964