Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings
- 1 July 1994
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 23 (7) , 583-594
- https://doi.org/10.1007/bf02653343
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Phase equilibria of the cu-in system I: Experimental investigationJournal of Phase Equilibria and Diffusion, 1993
- Interdiffusion Between in Layer and Bulk Cu or Cu-In AlloyPhysica Status Solidi (a), 1990
- A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its AlloysTransactions of the IMF, 1973