Free Convection Cooling of Electronic Systems
- 1 June 1973
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 9 (2) , 75-86
- https://doi.org/10.1109/tphp.1973.1136712
Abstract
No abstract availableKeywords
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