On the mechanism of levelling by addition agents in electrodeposition of metals
- 1 March 1965
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 10 (3) , 253-261
- https://doi.org/10.1016/0013-4686(65)87023-2
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Radiotracer Study of Addition Agent Behaviour: 1—Incorporation of Sulphur and Carbon in Nickel Deposited from Solutions Containing ThioureaTransactions of the IMF, 1962
- Mechanism of Addition Agent Reaction in Bright and Leveling Nickel DepositionJournal of the Electrochemical Society, 1961
- Levelling Action During Electrodeposition in Nickel and Acid-Copper SolutionsTransactions of the IMF, 1960
- Further Studies of Leveling Using Radiotracer TechniquesJournal of the Electrochemical Society, 1960
- A Radioisotopic Study of Leveling in Bright Nickel Electroplating BathsJournal of the Electrochemical Society, 1959
- An Investigation of the Mechanism of Levelling in ElectrodepositionTransactions of the IMF, 1956