Depth profiling of integrated circuits with thermal wave electron microscopy
- 20 November 1980
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 16 (24) , 928-930
- https://doi.org/10.1049/el:19800662
Abstract
Nondestructive depth profiling of integrated circuits is performed with thermal wave electron microscopy at 640 kHz modulation frequency.Keywords
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