A quantitative analysis of solid state bonding process based on fundamental bonding mechanisms. Part 1. Modeling and numerical analysis of bonding process.
Open Access
- 1 January 1985
- journal article
- Published by Japan Welding Society in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
- Vol. 3 (2) , 303-309
- https://doi.org/10.2207/qjjws.3.303
Abstract
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