Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability
- 1 May 2002
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 31 (5) , 520-528
- https://doi.org/10.1007/s11664-002-0109-4
Abstract
No abstract availableKeywords
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