Materials and processing for 0.25 μm multilevel interconnect

• 1 January 1997
• journal article
• Published by Elsevier in Microelectronic Engineering
• Vol. 33  (1-4) , 175-188
• https://doi.org/10.1016/s0167-9317(96)00043-3

Abstract

Keywords

• INTERCONNECT
• DIELECTRIC
• PROCESS MODULES
• ETCH
• GAP FILL