Application of a CFD tool for system-level thermal simulation
- 1 January 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 17 (4) , 564-572
- https://doi.org/10.1109/95.335043
Abstract
No abstract availableKeywords
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- Thermal Model of a PCJournal of Electronic Packaging, 1994
- A First Course in TurbulencePublished by MIT Press ,1972