Analysis of Electric Stress Distribution in Cavities embedded within Dielectric Structures

1 April 1986

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electrical Insulation

Vol. EI-21 (2) , 213-219
https://doi.org/10.1109/TEI.1986.348947

Abstract

Electric stress distribution within dielectric cavities are studied using the finite-element numerical technique. The results indicate that the electric stress is enhanced within a gas-filled cavity embedded in the dielectric. The amount of stress enchancement and the electric field distribution within the dielectric are significantly influenced by the dielectric permittivity, the dimensions of the cavity, the number of cavities in series within the dielectric gap, the cavity orientation, the dielectric thickness (electrode spacing), the contour of the edge of the electrodes, and the presence of floating electrodes near electrode edges. The effect of various parameters on the stress distribution within a dielectric is important in the design, fabrication, and testing of devices made of multi-layered dielectric/electrode film structures.

Keywords

This publication has 2 references indexed in Scilit:

Electric Field Distribution at Solid Insulator-Vacuum Interface of Different Electrode-Insulator Geometries
IEEE Transactions on Electrical Insulation, 1984
Electric stress in a circular cylindrical gaseous cavity in a solid dielectric, the axis of the cylinder being parallel to the field
Proceedings of the Institution of Electrical Engineers, 1966