Spinodal Cu-Ni-Sn Alloys for Electronic Applications
- 1 November 1984
- journal article
- physical and-mechanical-metallurgy
- Published by Springer Nature in JOM
- Vol. 36 (11) , 52-54
- https://doi.org/10.1007/bf03338616
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Compaction of Metal Powder by RollingPowder Metallurgy, 1984
- Stressed state of powder in the lag zone during rollingPowder Metallurgy and Metal Ceramics, 1983
- Spinodal decomposition in Cu-9wt% Ni-6wt% Sn—II. A critical examination of mechanical strength of spinodal alloysActa Metallurgica, 1974
- Spinodal decomposition in a Cu-9 wt% Ni-6 wt% Sn alloyActa Metallurgica, 1974