Electrical analysis of a thin film multichip module substrate

• 2 January 2003
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 138-141
• https://doi.org/10.1109/mcmc.1992.201468

Abstract

Keywords

• FUNCTION
• MODULE
• CIRCUIT
• AUTHOR
• ELECTRICAL ANALYSIS
• MULTICHIP
• MOTOROLA
• PACKAGES