The kinetics of grain boundary grooving in copper
- 11 June 2003
- journal article
- Published by Elsevier
- Vol. 7 (3) , 163-170
- https://doi.org/10.1016/0001-6160(59)90069-0
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Theory of Thermal GroovingJournal of Applied Physics, 1957
- Rates of surface self-diffusion over the principal planes of a single crystal of copperTransactions of the Faraday Society, 1956
- Self-Diffusion in CopperPhysical Review B, 1954
- Calculation of Diffusion Penetration Curves for Surface and Grain Boundary DiffusionJournal of Applied Physics, 1951
- Effect of Change of Scale on Sintering PhenomenaJournal of Applied Physics, 1950