Adhesion and debonding of multi-layer thin film structures
- 1 December 1998
- journal article
- Published by Elsevier
- Vol. 61 (1) , 141-162
- https://doi.org/10.1016/s0013-7944(98)00052-6
Abstract
No abstract availableKeywords
This publication has 28 references indexed in Scilit:
- Electrostatic adhesion testing of electronic metallizationsReview of Scientific Instruments, 1997
- Effects of Interface Nonplanarity on the Interface Fracture Energy of the TiN/SiO2SystemMRS Proceedings, 1997
- Comments on “A new procedure for measuring the decohesion energy for thin ductile films on substrates,” by A. Bagchi, G. E. Lucas, Z. Suo, and A. G. Evans [J. Mater. Res. 9, 1734 (1994)]Journal of Materials Research, 1996
- Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film StructuresMRS Proceedings, 1995
- Toughness of an interface along a thin ductile layer joining elastic solidsPhilosophical Magazine A, 1994
- A new procedure for measuring the decohesion energy for thin ductile films on substratesJournal of Materials Research, 1994
- Stress-Corrosion Cracking at Ceramic-Metal InterfacesMRS Proceedings, 1993
- Elastic Fracture Mechanics of the Peel-Test GeometryThe Journal of Adhesion, 1992
- Plastic zone estimates in mode I interlaminar fracture of interleaved compositesEngineering Fracture Mechanics, 1992
- The blister test for interface toughness measurementEngineering Fracture Mechanics, 1991