Shear modulus gradients in adhesive interfaces as determined by means of ultrasonic Rayleigh waves (II)

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Abstract
Ultrasonic Rayleigh wave measurements made earlier on several different types of adhesives have led to the finding of a distinct gradient in shear modulus through the interfacial accommodation zone. As reported here, different preparations of substrate appear to have little effect on the nature and extent of the modulus gradient. However, cure time is found to play a significant role concerning the very existence of a gradient in shear modulus through the bondline region of an adhesive. The stated gradient may be attributable to residual stress in the interfacial zone.

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