Chip scale packaging for modern electronics - Book Review

• 2 August 2004
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electrical Insulation Magazine
• Vol. 20  (4) , 47
• https://doi.org/10.1109/MEI.2004.1318852

Abstract

Keywords

• BOOK REVIEWS
• CHIP SCALE PACKAGING
• WAFER SCALE INTEGRATION
• ENCYCLOPEDIAS
• ELECTRONICS PACKAGING
• INTEGRATED CIRCUIT PACKAGING
• SECTIONS
• CONSUMER ELECTRONICS
• PLASTIC PACKAGING
• AEROSPACE MATERIALS