Gold coatings for fluxless soldering

This publication has 10 references indexed in Scilit:

• Constitution of AuSn–Pb–Sn partial ternary system
  Materials Science and Technology, 1985
• The Au−Ge (Gold-Germanium) system
  Bulletin of Alloy Phase Diagrams, 1984
• The Au−Si (Gold-Silicon) system
  Bulletin of Alloy Phase Diagrams, 1983
• Layer growth in Au-Pb/In solder joints
  Metallurgical Transactions A, 1976
• The wettability and dissolution behaviour of gold in soft soldering
  Gold Bulletin, 1976
• Thermal Analysis of the Ag–Au–Sn Ternary System in the Region from 20 to 100% Sn
  Metal Science, 1974
• The Use of Tin when Alloyed with Nickel or Lead as a Printed Circuit Finish
  Transactions of the IMF, 1972
• Soft soldering gold coated surfaces
  Gold Bulletin, 1971
• The Au-Pb-Sn ternary system
  Journal of the Less Common Metals, 1967
• Embrittlement of Solder by Gold from Plated Surfaces
  Published by ASTM International ,1963