A simple punchthrough model for short-channel MOSFET's
- 1 October 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 30 (10) , 1354-1359
- https://doi.org/10.1109/t-ed.1983.21298
Abstract
Punchthrough currents impose severe limitations on the minimum channel length and leakage currents of scaled MOS transistors. A simple model is proposed to calculate the low-level punchthrough characteristics. Taking into account the two-dimensional geometrical effects, this model calculates the drain-induced barrier-lowering (DIBL) and the punchthrough current as a function of the processing parameters, and the gate, drain, and substrate bias. Experiments on devices with substrate dopings 6 × 1014and 6.6 × 1015cm-3and channel lengths from 1 to 2 µm show good agreement with the theory.Keywords
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