Resistance computations for multilayer packaging structures by applying the boundary element method
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (1) , 87-96
- https://doi.org/10.1109/33.124196
Abstract
No abstract availableKeywords
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