Packaging and cooling problems associated with microelectronics equipment

• 1 November 1969
• journal article
• Published by Elsevier in Microelectronics Reliability
• Vol. 8  (4) , 331-337
• https://doi.org/10.1016/0026-2714(69)90394-1

Abstract

Keywords

• MICROELECTRONICS EQUIPMENT
• COOLING PROBLEMS
• PROBLEMS ASSOCIATED
• PACKAGING AND COOLING