The Electrodeposition of Copper from Non-Aqueous Solutions: II The Acetic Acid-Pyridine System

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Abstract
The general problem of electrodeposition of metallic coatings on to active metal substrates is briefly discussed. A detailed study of the electrodeposition of copper from a bath containing copper acetate dissolved in acetic acid-pyridine solutions containing 20% by volume of pyridine is then presented. The variation of cathode current efficiency as a function of current density and temperature was studied at current densities in the range 1 to 12 A/ft2 at temperatures from 25° to 62·5°C. At 6 A/ft2, temperature had the most marked influence on current efficiency which increased from ~ 60% at 25° to a maximum value of 112% at 50°C. A wide variety of types of coating were obtained from the bath by appropriate variation of the deposition conditions. These varied from ductile, matt, adherent coatings, with columnar structures resembling those from acid copper baths, to ductile, high reflecting coatings with layered structures which were similar to those obtained from aqueous baths in the presence of addition agents. The results of the investigations are discussed with respect to present knowledge concerning the chemistry of the acetic acid-pyridine system.

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