Device for simultaneously measuring stress, strain, and resistance in ‘‘whiskerlike’’ materials in the temperature range 1.5 K<T<360 K
- 1 April 1991
- journal article
- research article
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 62 (4) , 1010-1014
- https://doi.org/10.1063/1.1142050
Abstract
We describe a device for measuring Young’s modulus Y and the piezoresistance of ‘‘whiskerlike’’ samples. The device can be used in a standard vari‐temp Dewar in the temperature range 1.5 K<T3. We also measured the Young’s modulus of some Cu whiskers for comparison.Keywords
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