Properties of Sn-Bi Solders and Its Interface with Cu.

• 1 January 1997
• journal article
• Published by Japan Institute of Electronics Packaging in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
• Vol. 12  (6) , 406-412
• https://doi.org/10.5104/jiep1995.12.406

Abstract

Keywords

• PROPERTIES OF SN
• INTERFACE
• SN BI SOLDERS