A D&T Roundtable: Testing Mixed Logic and DRAM Chipshigher throughput devices has put the integration of DRAM into a new spectrum.]
- 1 April 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test of Computers
- Vol. 15 (2) , 86-92
- https://doi.org/10.1109/MDT.1998.679212
Abstract
The ability to increase the bandwidth and number of I/Os from embedded DRAMs and to support 3D graphics and higher throughput devices has put the integration of DRAM into a new spectrum. Because of their impact on process technology and test, these devices present us with several new challenges. At a November 1997 roundtable, experts from a variety of specialties explored test impacts and the challenges ahead.Keywords
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